PCI PAR 360

SMP parquet adhesive
PCI PAR 360
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  • Very low emissions PLUS, GEV-EMICODE EC 1 PLUS R.
  • Solvent free to German standard TRGS 610; Giscode RS 10.
  • Water free, no swelling effect on the parquet flooring.
  • Ready to use.
  • Good trowel ridge formation.
  • Relatively hard adhesive bed with elastic properties.

EMICODE: EC1 PLUS
colour: caramel
packaging: 16-kg-pail
  • SMP parquet adhesive for interior floors.
  • For gluing
    - on-edge strip parquet flooring to EN 14761
    - mosaic parquet elements to EN 13488
    - multi-layer parquet flooring to EN 13489 (two-layer parquet floorboards up to max. 120 cm, three-layer parquet floorboards up to max. 250 cm)
    - laminate flooring.
  • Suitable for underfloor heating.
  • Suitable for gluing PCI DU 903 FH sound reducing underlay.
PCI PAR 360
SMP parquet adhesive
Technical Datasheet: 76
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name Licensing GEV EMICODE (EC1 PLUS) rules and standards GEV EMICODE (EC1 PLUS) combined with product PCI PAR 360